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Mohammad Humood

Mohammad Humood

Recently, there has been a lot of attention to develop flexible or wearable electronic devices, which can be integrated into clothes, glasses, skin and even inside the human body. These devices are required to be mechanically robust and able to retain their performance and efficiency under different ranges of mechanical deformations such as bending and twisting without any failure in the rigid components of these devices such as silicon and copper.

Biology such as human skins and organs is inherently a 3D design. Therefore, 3D nano/micro structured flexible devices will yield a complete integration between life and technology. To achieve this target for durable flexible electronics, we developed 3D multilayers structures based on the well-known Japanese art of Kirigami. The 3D Kirigami structures are promising as a building block for these flexible electronics for few reasons. First, the mechanical testing of Kirigami structures showed an enhanced mechanical robustness and durability. The structures were cycled under compression and found to be robust and resilient. In addition, the 3D compliant arrangement will allow the silicon to vibrate without any mechanical limitation. Thus, it prevents any residual stress to accumulate inside the silicon layer.

To the best of my knowledge, we are the first to study the nanomechanics of silicon-based Kirigami structures. We have carried out advanced In-Situ Scanning electron microscope (SEM) compression experiments to better understand the mechanical behavior of these devices. In addition, a finite element analysis (FEA) model was developed. I presented my work recently in the Materials Research Society in 2017, titled “Nanomechanical Behavior of 3D Silicon-Based Kirigami Structures Using Flat Punch Indentation”. Also, in the meanwhile, two journal papers are in-progress about the nanomechanics of the Kirigami structures and how the different fabrication conditions can influence the mechanical behavior of these 3D structures. The outcome of this work will be a better understanding of their nanomechanics and recommendations in how to fabricate more robust and durable 3D structures.

The opportunity to work with a pioneer of bioelectronics such as Faculty Fellow Dr. John A. Rogers through the Hagler Institute for Advanced Study was a great “hook” for me to achieve a bright future academic career. My interactions and meetings with Dr. Rogers and his group have been very fruitful and I have learnt a lot from their experiences about the fabrication of flexible electronics. I am very grateful for such an opportunity. In addition, the HEEP fellowship funding took care of my tuition, most of my fees and a generous stipend for the whole year. Being financially secured this year helped me to focus and dedicate more time to my research work.  

This year, I was a graduate student fellow with the Hagler Institute for Advanced Study.  I hope one day I will succeed to contribute highly to science/engineering in general and to the field of biomechanics in a way to improve and advance human life. My ambition is to be back as a nominated fellow with the Hagler Institute for Advanced Study one day in the future and work with students and faculty in Texas A&M University. Thank you for your fellowship.  Best Regards.  


Mechanical Engineering

Graduation Year

May 2019

Degree Type


Fellowship Year(s)

'16- '17

Previous Education

B.S. in Mechanical Engineering - Khalifa University - '13


Andreas A. Polycarpou

Journal Articles

1. Humood, M; Han, M; Shi, Y; Zheng, Y; Lefebvre, Pharr, M, J; Huang, Y; Rogers, J; Polycarpou, A. In situ SEM compression reveals enhanced mechanical robustness in 3D Multilayers Kirigami Structures. 2017. In Progress.

2. Humood, M.; Nam, Y.; Kim, H; Polycarpou, A. A. High Capacity Lithium-ion Batteries Based on Silicon Nanowire/Carbon Composite. 2017. (Submitted)


Humood, M; Han, M; Zheng, Y; Pharr, M; Rogers, J; Polycarpou, A. 2017. Nanomechanical Behavior of 3D Silicon-Based Kirigami Structures Using Flat Punch Indentation. MRS Spring Meeting, Phenoix, Arizona, 2017


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